IC Packaging Engineer, Materials and Packaging Characterization

Apple

Apple

San Francisco, CA, USA · New York, USA · San Francisco Bay Area, CA, USA

USD 181,100-318,400 / year + Equity

Posted on May 1, 2026
Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention to detail and a passion for excellence to work towards extraordinary results? We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and help shape the next generation of category-defining Apple products.
As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness.
  • Package Characterization: Design and execute testing of IC packages under rigorous environmental and reliability stress conditions, including dynamic mechanical loading, thermal cycling, and moisture stressing.
  • Material Evaluation: Lead the characterization of advanced packaging materials (e.g., solders, polymers, dielectrics) and manage material characterization activities at external suppliers.
  • Methodology Development: Develop novel experimental methodologies, including designing custom fixtures, setting up specialized test equipment, and integrating advanced data acquisition systems.
  • Failure Analysis: Drive root-cause analysis and troubleshooting for complex packaging-related yield and reliability issues.
  • BS and a minimum of 10 years relevant industry experience or equivalent
  • BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred
  • Experimental Mechanics: Proven track record in experimental mechanics, material characterization, and the hands-on setup of test equipment.
  • Analytical Tools: Hands-on experience with advanced material and failure analysis techniques (e.g., SEM, EDX, FIB, CSAM).
  • Computational Skills: Proficiency with numerical simulation software, alongside strong programming capabilities in MATLAB and/or Scientific Python. Familiarity with Gen-AI, Machine Learning, and statistical data analysis is highly desirable.
  • Leadership & Communication: Ability to drive independent R&D initiatives, paired with excellent communication skills to confidently present complex data, ideas, and strategic plans to cross-functional teams.
  • Domain Expertise: Understanding of electronic packaging architectures, assembly processes, and package qualification requirements, coupled with a strong grasp of the mechanical behavior and reliability physics of packaging materials.