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IC Package Design Engineer

Location: San Francisco, CA, USA; New York, USA; San Francisco Bay Area, CA, USA
Compensation:

USD 129,300-225,300 / year + Equity

Posted:
25 days
Mid-Senior Level
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Hardware
Mobile Devices
Operating Systems
TV
Wearables

IC Package Design Engineer

Location: Austin, TX, USA
Posted:
25 days
Mid-Senior Level
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Hardware
Mobile Devices
Operating Systems
TV
Wearables

IC Package Design Engineer

Location: Austin, TX, USA; New York, USA; Los Angeles, CA, USA
Compensation:

USD 122,700-214,300 / year + Equity

Posted:
25 days
Mid-Senior Level
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Hardware
Mobile Devices
Operating Systems
TV
Wearables

IC Package Design Engineer

Location: San Francisco, CA, USA; New York, USA; San Francisco Bay Area, CA, USA
Compensation:

USD 184,700-324,800 / year + Equity

Posted:
25 days
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Hardware
Mobile Devices
Operating Systems
TV
Wearables

IC Package Design Engineer

Location: Austin, TX, USA; New York, USA; Los Angeles, CA, USA
Compensation:

USD 175k-308,500 / year + Equity

Posted:
25 days
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Hardware
Mobile Devices
Operating Systems
TV
Wearables

IC Package Design Engineer

Location: Austin, TX, USA
Posted:
25 days
Senior
Apps
Artificial Intelligence (AI)
Broadcasting
Consumer Electronics
Digital Entertainment
Hardware
Mobile Devices
Operating Systems
TV
Wearables